After graduating from Northeastern University in 2017, I joined ASML in Wilton, Connecticut. I have held 3 different positions in my career at ASML thus far; please click on each experience to learn a little more about my accomplishments. Due to data privacy restrictions, I cannot disclose too much detail on the specifics of the projects I worked on.

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ASML: Team Lead for YieldStar (YS) Module

October 2019 – Current

The YieldStar Module is a metrology device that provides nanometer level resolution for overlay and focus measurements of wafers post-exposure. As Team Lead, I am accountable for a team of 18 design engineers. I own the planning and execution of key milestones needed in order to achieve a fully developed next-generation YS Module in a fast-paced project timeline.

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ASML: Team Lead for Ultra Violet Level Sensor (UVLS)

July 2018 – October 2019

As Team Lead on UVLS, I was accountable for a team of 3 design engineers. I owned the planning and execution for issues observed in the field and the UVLS was a volume produced sensor. I worked closely with designers in creating containment solutions and providing structural fixes within a fast-paced timeline, and I was responsible for the cross-sector to be fully aligned with the solution and implementation strategy.

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ASML: Design Engineer for Ultra Violet Level Sensor (UVLS)

September 2017 – July 2018

The UVLS is an opto-mechanical assembly that is capable of measuring the height topography of a wafer to nanometer level precision. As designer on the team, I worked on various tasks- the most significant being my work on a test stand used to qualify the sensor.